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JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

JESD79-2E

April 2008

JEDEC

STANDARD

DDR2 SDRAM SPECIFICATION

(Revision of JESD79-2D)

NOTICE

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approved through the JEDEC Board of Directors level and subsequently reviewed and approved

by the JEDEC legal Counsel.

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JEDEC standards and publications are adopted without regard to whether or not their adoption

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any liability to any patent owner, nor does it assume any obligation whatever to parties adopting

the JEDEC standards or publications.

The information included in JEDEC standards and publications represents a sound approach to

product specification and application, principally from the solid state device manufacturer

viewpoint. Within the JEDEC organization, there are procedures whereby a JEDEC standard or

publication may be further processed and ultimately become an ANSI standard.

No claims to be in conformance with this standard may be made unless all requirements stated in

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Published by

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This document is copyrighted by the Electronic Industries Alliance and may not be

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or call (703) 907-7559

JEDEC Standard No. 79-2E

Contents

1 Scope ................................................................................................................................................. 1

2 Package ballout & addressing ......................................................................................................... 2

2.1 DDR2 SDRAM package ballout ...................................................................................................... 2

2.2 Quad-stacked/quad-die DDR2 SDRAM internal rank associations .............................................. 11

2.3 Input/output functional description ................................................................................................ 13

2.4 DDR2 SDRAM addressing ............................................................................................................ 14

3 Functional description ................................................................................................................... 16

3.1 Simplified state diagram ................................................................................................................ 16

3.2 Basic functionality ......................................................................................................................... 16

3.3 Power-up and initialization ............................................................................................................ 16

3.3.1 Power-up and initialization sequence ........................................................................................ 17

3.4 Programming the mode and extended mode registers ................................................................. 18

3.4.1 DDR2 SDRAM mode register (MR) ........................................................................................... 18

3.4.2 DDR2 SDRAM extended mode registers (EMR(#)) ................................................................... 19

3.4.3 Off-chip driver (OCD) impedance adjustment ............................................................................ 24

3.4.4 ODT (on-die termination) ........................................................................................................... 27

3.4.5 ODT related timings ................................................................................................................... 27

3.5 Bank activate command ................................................................................................................ 32

3.6 Read and write access modes ...................................................................................................... 32

3.6.1 Posted CAS ............................................................................................................................... 32

3.6.2 Burst mode operation ................................................................................................................ 34

3.6.3 Burst read command ................................................................................................................. 34

3.6.4 Burst write operation .................................................................................................................. 37

3.6.5 Write data mask ......................................................................................................................... 40

3.7 Precharge operation ..................................................................................................................... 41

3.7.1 Burst read operation followed by precharge .............................................................................. 42

3.7.2 Burst write followed by precharge .............................................................................................. 44

3.8 Auto precharge operation ............................................................................................................. 45

3.8.1 Burst read with auto precharge .................................................................................................. 46

3.8.2 Burst write with auto precharge ................................................................................................. 48

3.9 Refresh command ......................................................................................................................... 49

3.10 Self refresh operation .................................................................................................................... 50

3.11 Power-down .................................................................................................................................. 51

3.12 Asynchronous CKE LOW event .................................................................................................... 55

3.13 Input clock frequency change during precharge power down ....................................................... 56

3.14 SSC (Spread Spectrum Clocking) ................................................................................................ 57

3.14.1 Terms and definitions ................................................................................................................ 57

3.14.2 SSC (Spread Spectrum Clocking) Criteria ................................................................................. 57

3.14.3 Allowed SSC band .................................................................................................................... 57

3.15 No operation command ................................................................................................................. 57

3.16 Deselect command ....................................................................................................................... 57

4 Truth tables ..................................................................................................................................... 58

4.1 Command truth table .................................................................................................................... 58

4.2 Clock enable truth table. ............................................................................................................... 59

4.3 Data mask truth table. ................................................................................................................... 60

5 Absolute maximum DC ratings ...................................................................................................... 61

6 AC & DC operating conditions ...................................................................................................... 62

Annex A (informative) Differences between JESD79-2E and JESD79-2D..................................... 109

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