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JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

JESD79-3A

September 2007

JEDEC

STANDARD

DDR3 SDRAM Specification

(Revision of JESD79-3)

NOTICE

JEDEC standards and publications contain material that has been prepared, reviewed, and

approved through the JEDEC Board of Directors level and subsequently reviewed and approved

by the JEDEC legal Counsel.

JEDEC standards and publications are designed to serve the public interest through eliminating

misunderstandings between manufacturers and purchasers, facilitating interchangeability and

improvement of products, and assisting the purchaser in selecting and obtaining with minimum

delay the proper product for use by those other than JEDEC members, whether the standard is to

be used either domestically or internationally.

JEDEC standards and publications are adopted without regard to whether or not their adoption

may involve patents or articles, materials, or processes. By such action JEDEC does not assume

any liability to any patent owner, nor does it assume any obligation whatever to parties adopting

the JEDEC standards or publications.

The information included in JEDEC standards and publications represents a sound approach to

product specification and application, principally from the solid state device manufacturer

viewpoint. Within the JEDEC organization, there are procedures whereby a JEDEC standard or

publication mya be further processed and ultimately become an ANSI standard.

No claims to be in conformance with this standard may be made unless all requirements stated in

the standard are met.

Inquiries, comments, and suggestions relative to the content of this JEDEC standard or

publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or

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Published by

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Arlington, VA 22201-3834

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This document is copyrighted by JEDEC and may not be

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JEDEC Solid State Technology Association

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or call (703) 907-7559

JEDEC Standard No. 79-3A

Contents

1 Scope..........................................................................................................................................1

2 DDR3 SDRAM Package Pinout and Addressing ......................................................................3

2.1 DDR3 SDRAM x4 Ballout using MO-207 (Top view: see balls through package) ...... 3

2.2 DDR3 SDRAM x8 Ballout using MO-207 (Top view: see balls through package) ..... 4

2.3 DDR3 SDRAM x16 Ballout using MO-207 (Top view: see balls through package)..... 5

2.4 Stacked / dual-die DDR3 SDRAM x4 Ballout using MO-207 (Top view: see balls through

package).............................................................................................. 6

2.5 Stacked / dual-die DDR3 SDRAM x8 Ballout using MO-207 (Top view: see balls through

package).............................................................................................. 7

2.6 Stacked / dual-die DDR3 SDRAM x16 Ballout using MO-207 (Top view: see balls through

package).............................................................................................. 8

2.7 Pinout Description..............................................................................................................9

2.8 DDR3 SDRAM Addressing.............................................................................................11

2.8.1 512Mb .....................................................................................................................11

2.8.2 1Gb ...........................................................................................................................11

2.8.3 2Gb ..........................................................................................................................11

2.8.4 4Gb ..........................................................................................................................11

2.8.5 8Gb ..........................................................................................................................12

3 Functional Description.............................................................................................................13

3.1 Simplified State Diagram.................................................................................................13

3.2 Basic Functionality...........................................................................................................14

3.3 RESET and Initialization Procedure ................................................................................15

3.3.1 Power-up Initialization Sequence.............................................................................15

3.3.2 Reset Initialization with Stable Power .....................................................................17

3.4 Register Definition ...........................................................................................................18

3.4.1 Programming the Mode Registers............................................................................18

3.4.2 Mode Register MR0 .................................................................................................18

3.4.3 Mode Register MR1 .................................................................................................22

3.4.4 Mode Register MR2 .................................................................................................25

3.4.5 Mode Register MR3 .................................................................................................27

4 DDR3 SDRAM Command Description and Operation...........................................................29

4.1 Command Truth Table .....................................................................................................29

4.2 CKE Truth Table..............................................................................................................31

4.3 No OPeration (NOP) Command ......................................................................................32

4.4 Deselect Command ..........................................................................................................32

4.5 DLL-off Mode..................................................................................................................33

4.6 DLL on/off switching procedure......................................................................................34

4.6.1 DLL “on” to DLL “off” Procedure ..........................................................................34

4.6.2 DLL “off” to DLL “on” Procedure ..........................................................................35

4.7 Input clock frequency change ..........................................................................................36

4.8 Write Leveling .................................................................................................................38

4.8.1 DRAM setting for write leveling & DRAM termination function in that mode......38

4.8.2 Procedure Description ..............................................................................................39

4.8.3 Write Leveling Mode Exit........................................................................................41

4.9 Extended Temperature Usage ..........................................................................................42

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