JMF608 开卡工具MP 版本V2.0
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固态硬盘开卡工具
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[20160125] r1.00.104.007
1. Add CustomerID functioin.
1) As Normal F/W, pls set CustomerID=1 (default setting)
2) As Write Boost FW, pls set CustomerID=4 (just support 128GB SSD capacity). This version of F/W will enhance S.W, 4K-R.R and 4K-R.W performance.
2. Support 4GB, 8GB and 16GB full SSD capacity but they must conform to CH+CE ¡Ø 4 or 4CH2CE configuration.
3. Improve WAI and 4KB Random Write for 4GB, 8GB and 16GB full SSD capacity.
4. Support CAP Farm feature.
5. For the flash of L84C or Page Number ¡Ù 512, these types of flash can not support full SSD capacity application for all the SSD capacity.
6. For 32GB ~ 128GB SSD capacity of both Normal F/W and WB F/W, they can not support full capacity application, it meams that they should be set over provisioning. (OP=12.6%)
7. Support two plane erase to speed up scan defect bad block procedure. (MPTool dependent)
[TestItems]
EnTwoPlaneErase=1
8. Add new vendor command to get defect ratio. (include CH sync defect ratio, each Die defect ratio)
>> When TotalDefRatio = 0, diaable scan total Defect Ratio.
9. Add auto select TMC profile by NAND interface function.
10. Fix tool hang issue with vendor command failed.
11. Limit "ResPercentage" - "DefPercentage" must ¡Ù 58 (i.e. 5.8%)
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[20151103] r1.00.100.002
1. Pass 5K times abnormal power cycle test.
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[20151012] r1.00.100.000
1. Enhance R.R performance if set OP=12.6%.
2. Enhance L85C_120GB S.W performance if set OP=12.6%, other types of flash also can be enhanced but fine tune by JM R&D is prefer.
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[20151221] r1.00.095.016
1. Support SDK 15nmm NAND Flash.
1. Support SDK multi-LUN NAND Flash.
1. Support TSB 32nm TH58TVG7E2FBA89 & TH58TVG8E2FBA89.
1. Improve performance for HDTune test.
2. Fixed lower read performance issue.
3. Support SDK SANDISKLT008G(BGA package but run Toggle1.0 only) & SDTNPACHEMXXX(TSOP package but run Legacy only)
1. Add SMART attribute 0xA3 to display the total number of early bad block.
2. Add bar code checkbox in MPT.
1. Improve performance drop issue.
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[20150813] r1.00.095.008
1. Update Flash.ini for TSB 15nm NAND Flash.
2. Add BIN files for TSB 15nm NAND Flash.
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[20150623] r1.00.095.008
1. Fixed wrong bad block number while occurred C03 Fail by MPT.
2. Modify FW bin file naming rule for shift read mode.
3. Add keep PFormat setting function.
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[20150528] r1.00.095.005
1. Change F/W interface version 3 value as 4 due to CMT size changed.
2. Support TSB 15nm NAND Flash.
3. Support Hynix 20nm Multi-Lun.
4. Modify Hynix flash naming rule.
5. Fix check pair page message.
6. Support SDK 19nm type C NAND Flash.
7. Support Hynix 20nm A-Die NAND Flash.
8. Support SDK A19 NAND Flash.
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[20150408] r1.00.094.032
1. Modify to vFlashReadRctPost for Mircon MultiLun that improve performace of interleave.
2. To avoid FW has no chance to do merge when the test only enables FW to update SYSInfo.
3. Add new vendor command. (0x27, SATA_CMD_GET_PAIR_PAGE_TABLE, for sorting use)
4. Modify check flash interface's behavior.
- Check flash interface = Check SB + Check flash reset +Check flash data path + Check ECC engine
5. Fix a remap bug.
- On an unexpect case, remap will be incomplete. So we add a condition to fix it.
6. Fix check pair page behavior.
- Auto detect shouldn't do check pair page.
- Check flash module will do check pair page.
- SLC doesn't do check pair page.
7. Add SPI flash AT25DF512C to support list.
8. Remove redundancy space before SN in log.
9. Remove unnecessary LoadGDP.
10. Add check sorting result.
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[20150210] r1.00.094.024
1. Fixed a bug for power loss fail.
2. Fixed bug of device sleep fail if resume from device sleep.
3. Modify device sleep that only slumber state can enter device sleep.
4. Fixed NBT data miscompart issue in some corner case.
5. Fixed SMART self-test issue.
6. Add 6th ID for flash auto-detect.
7. Fixed flash module test fail with 6th ID.
8. Add error code(M01) for check pair-page table fail.
9. Set default value of EnCheckPairPage to 1.
10. Modify pair-page table 7.
11. Fixed NTFS detection method for GUID Partition Table.
12. Add new naming rule for Sandisk MLC two-plan dual page with shift-read.
13. Add new method to detect CH/BK and report more info to MPT.
14. Add Hynix 20nm support.
15. Fix bug of GPIO6 ISR event not be triggered.
16. Skip wFtlMergeReqGC request DBMT block if DBMT block < 4.
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[20141216] r1.00.094.012
1. Improve WAI.
2. Improve table flush efficiency for no free block issue.
3. Shorten the boot time after abnormal power cycling test.
4. Improve command response time.
5. For SLC NAND Flash, fix system can not wake up, data mis-compare,¡Ketc. issues after abnormal power cycling test.
6. The older firmware version, such as r93, r92 or eariler, can not download microcode by Windows updater due to r94 firmware with a new interface.
7. Fix Read Flash ID abnormal issue.
8. Add panel auto-alignment function in MP tool.
9. Support SLC 4KB page NAND Flaash.
10. Improve TSB Toggle 2.0 SLC NAND Flaash.
11. Add suggestion OP percentage into NAND Flash Support List.
12. Fix new remap issue.
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[20141113] r1.00.093.029
1. Improve WAI.
2. Improve table flush efficiency for no free block issue.
3. Add ProgramFail and EraseFail for check RDT result.
4. Extend pair page index from 48 to 64 for 4KB page flash.
5. Fix wrong LBA value after checking tables.
6. Add new naming rule for SanDisk A19 two-planes flash.
7. Add new naming rule for 4-Die flash.
8. Add new naming rule for Toshiba A19 one-plane flash.
9. Support
1) Micron 25nm MLC L74A multi-LUN NAND Flash
2) TSB TSB 1Ynm one-plane NAND Flash
3) TSB 24nm MLC NAND Flash
4) TSB 19nm Type A NAND Flash
5) 4-LUN NAND Flash
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[20140911] r1.00.092.042
1. Fine tune the parameter of WL & GC for reduce WAI value, that is, enhance SSD¡¦s product life.
2. Add read Flash ID function.
3. Modify Pair-Page 2¡¦s table.
4. Use FW IDEMA formula to calculate SSD capacity.
5. Fix bug of GDP that loader block information may be incorrect.
6. Modify extend block number of TSB A19 NAND flash.
7. For TSB A19 NAND Flash, below is JMicron's suggestion but it depends on layout quality, and customers MUST do the verification test by themselves before mass production, to judge whether the drive current setting is correct for their PCBA or not.
1) TSOP package_Toggle1.0 : set to 10mA for all capacity.
2) BGA package_Toggle2.0 :
>> LUN = 1
-> 1CE, 10mA
« -> 2CE, 10mA
« -> 4CE, 12mA
>> LUN = 2 (multi-LUN)
« -> 1CE, 10mA
« -> 2CE, 12mA
« -> 4CE, 14mA
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[20140812] r1.00.092.037
1. Fixed some issues that occurred on A19 NAND Flash only.
2. Fixed system can not wake up issue if running S4 + Burn-In Test.
3. Fixed system busy issue on some ATOM platforms with ONFi 2.2/2.3 NAND Flash.
4. First release system firmware to support Intel/Micron multi-LUN NAND Flash, please refer to ¡§JMF608&JMF609_NAND Flash support list_ver 0.8_REV092.37¡¨ this document to know which NAND Flash types we have tested in our lab.
5. Add pair-page table 10 for Intel L84C
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JMF608 开卡软件MP V2.03.081.zip 大约有486个文件